Since its
advent in 1957, the early adopters of laser (light amplification by simulated
emission of radiation) technology were applications such as; ranging,
targeting, spectroscopy, and microscopy. The purpose of these applications was
either the exploration/measurement of distances or the scientific/laboratory
experiments. None of the above mentioned application promoted laser technology
on the commercial front. However, with the technological developments, lasers
became compact, robust, and versatile. Such developments triggered the
industrial and commercial applications such as; micro-machining, modeling,
precise sculpting, shaping and sizing objects and materials, and contactless
imprinting.
The
revenue generated from laser applications is supported by five critical pillars
– laboratory equipments, defense and military, compact disc read/write heads,
communications, and material processing. The research study, “Laser Processing
Market (2013 – 2018)” analyses the vital material processing segment. The
analysis is complemented by qualitative as well as quantitative data, later
being further divided into sales value, sale volume, and average selling price
(ASP) data sets. Each of the data set contains historical, estimated, and
forecasted values. The total laser processing market is segmented according to
the technology, processing techniques, base material, machine configuration,
vertical, application, and geography.
Segmentation
is done considering the supply side as well as the demand side market
parameters. Segments such as technology, processing techniques, and machine
configuration define the supply side market, whereas, base material, vertical,
application, and geography segments define the demand side market. The
technology segmentation divides the market according to the various laser
technologies such as CO2 laser, YAG lasers, fiber lasers, and excimer lasers.
On the other hand, the machine configuration segment describes how the above
mentioned lasers are used. Three types of configurations; moving material,
flying optics, and hybrid, along with the mode of operation are covered in the
report. Depending on the material type, lasers can be used in continuous mode
or in a pulsed mode. The laser market data covered for various technology segments
is mutually exclusive.
The major
supply side segment is the laser processing technique which includes laser
cutting, laser drilling, laser engraving, and laser marking. These four types
of material processing techniques have replaced the tradition mechanical
processing techniques on a large scale. Depending on the application, base
material type, and laser type, one can select a suitable processing technique.
Though, techniques are different, the application market for each type won’t be
mutually exclusive since multiple processing techniques may be applied to same
the product/application. The chapter also includes the level-2 segmentation of
processing techniques, giving market data sets for various types of drilling
(single pulse, percussion,trepanning, helical), cutting (fusion, flame,
sublimation), and marking (masking, carbon migration, bonding).
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Amongst
the demand side segments, application segment is of the prime importance. The
report discusses various applications with their respective impacts on the
total market, cannibalization factor, year-on-year growth trend, and TAM/SAM
data. Laser processing applications are also divided according to the
processing techniques employed, allowing the reader to analyze each of the
micro-markets individually. For example, the report differentiates between the
automotive application market for laser drilling and automotive application
market for laser cutting. Apart from the automotive segments, other major
verticals considered for the analysis are aerospace, architecture, commercial,
consumer electronics, industrial, medical, and semiconductor and electronics.
The report
also segments the parent market by various economic pockets such as; North
America, Europe, APAC, and ROW. Further, major countries contributing to the
market are analyzed with detailed representation of value and volume data.
Apart from the quantitative data, the report also includes qualitative data
analysis by the use of various tools and models. Porter’s five force analysis,
value chain analysis, price trend analysis, market dynamics, burning issues,
and winning imperatives are few of the analysis models used.
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Competitive landscape, along with the recent
developments in laser processing market is also discussed in the report. The
major companies covered in the report are; Epilog Laser (U.S.), Universal Laser
Systems (U.S.), Trotec Laser, Inc (U.S.), Needham-laser (U.K.), SEI Laser
(Italy), Eurolaser (Germany), LaserStar (U.S.), and Xenetech Global, Inc
(U.S.).
Table
of Content
1
Introduction
1.1 Key Take-Aways 18
1.2 Report Description 18
1.3 Markets Covered 20
1.4 Stakeholders 21
1.5 Report Assumptions 21
1.6 Research Methodology 23
1.6.1 Market Size Estimation 25
1.6.2 Market Crackdown And Data Triangulation 25
1.6.3 Key Data Points Taken From Secondary Sources 27
1.6.4 Key Data Points Taken From Primary Sources 27
1.6.5 List Of Major Companies And Organizations Covered In Primary Research 28
1.1 Key Take-Aways 18
1.2 Report Description 18
1.3 Markets Covered 20
1.4 Stakeholders 21
1.5 Report Assumptions 21
1.6 Research Methodology 23
1.6.1 Market Size Estimation 25
1.6.2 Market Crackdown And Data Triangulation 25
1.6.3 Key Data Points Taken From Secondary Sources 27
1.6.4 Key Data Points Taken From Primary Sources 27
1.6.5 List Of Major Companies And Organizations Covered In Primary Research 28
2
Executive Summary
3
Cover Story
4
Market Overview
4.1 Introduction 36
4.2 Market Definition Andscope 39
4.3 Market Segmentation 41
4.4 History And Evolution Of Laser Processing Market 43
4.5 Technology And Application Trends 45
4.6 Advantages Of Laser Material Processing 46
4.7 The Industrial Safety Factors 47
4.7.1 Maximum Permissible Exposure (MPE) Levels 47
4.7.2 Classification 48
4.7.2.1 By IEC Standard 48
4.7.2.2 By ANSI Standard 50
4.8 Market Dynamics 51
4.8.1 Drivers 51
4.8.1.1 Government Regulations For Compulsory Use Of Laser Marking 51
4.8.1.2 Outclassing Every Other Substitute Tools 52
4.8.1.3 Demand For The Aesthetics 53
4.8.1.4 Emerging Application In Oil And Gas Exploration Field 53
4.8.1.5 The Introduction Of Direct Diode Lasers 53
4.8.2 Restraints 54
4.8.2.1 High Initial Investment And High Maintenance Cost 54
4.8.2.2 Eurozone Crises 55
4.8.2.3 Rare Earth Elements Mining: Environmental Concerns 55
4.8.3 Opportunities 55
4.8.3.1 High Adoption Of Disk Lasers 55
4.8.3.2 Automotive Lights 56
4.8.3.3 Other Emerging Applications And Processes 57
4.9 Burning Issues 58
4.9.1 Technical Challenges With High Power Lasers 58
4.9.2 Safety Issues With Lasers 58
4.10 Winning Imperatives 59
4.10.1 Product Innovation Is The Key 59
4.10.2 Vertical Consolidation 59
4.10.3 Laser Doping Of Solar Cells (Lassol): Technology For Solar Cells 60
4.11 Porter's Five Forces Model 61
4.11.1 Threat From New Entrants 62
4.11.2 Threat From Substitutes 63
4.11.3 Bargaining Power Of Suppliers 64
4.11.4 Bargaining Power Of Buyers 65
4.11.5 Degree Of Competition 66
4.12 Value Chain 67
4.13 Price Trend Analysis 73
4.1 Introduction 36
4.2 Market Definition Andscope 39
4.3 Market Segmentation 41
4.4 History And Evolution Of Laser Processing Market 43
4.5 Technology And Application Trends 45
4.6 Advantages Of Laser Material Processing 46
4.7 The Industrial Safety Factors 47
4.7.1 Maximum Permissible Exposure (MPE) Levels 47
4.7.2 Classification 48
4.7.2.1 By IEC Standard 48
4.7.2.2 By ANSI Standard 50
4.8 Market Dynamics 51
4.8.1 Drivers 51
4.8.1.1 Government Regulations For Compulsory Use Of Laser Marking 51
4.8.1.2 Outclassing Every Other Substitute Tools 52
4.8.1.3 Demand For The Aesthetics 53
4.8.1.4 Emerging Application In Oil And Gas Exploration Field 53
4.8.1.5 The Introduction Of Direct Diode Lasers 53
4.8.2 Restraints 54
4.8.2.1 High Initial Investment And High Maintenance Cost 54
4.8.2.2 Eurozone Crises 55
4.8.2.3 Rare Earth Elements Mining: Environmental Concerns 55
4.8.3 Opportunities 55
4.8.3.1 High Adoption Of Disk Lasers 55
4.8.3.2 Automotive Lights 56
4.8.3.3 Other Emerging Applications And Processes 57
4.9 Burning Issues 58
4.9.1 Technical Challenges With High Power Lasers 58
4.9.2 Safety Issues With Lasers 58
4.10 Winning Imperatives 59
4.10.1 Product Innovation Is The Key 59
4.10.2 Vertical Consolidation 59
4.10.3 Laser Doping Of Solar Cells (Lassol): Technology For Solar Cells 60
4.11 Porter's Five Forces Model 61
4.11.1 Threat From New Entrants 62
4.11.2 Threat From Substitutes 63
4.11.3 Bargaining Power Of Suppliers 64
4.11.4 Bargaining Power Of Buyers 65
4.11.5 Degree Of Competition 66
4.12 Value Chain 67
4.13 Price Trend Analysis 73
5
Segmentation By Technology
5.1 Introduction 75
5.2 Lasers Source And Laser System Market Comparison 77
5.3 Gas Lasers 79
5.3.1 Co2 Lasers 79
5.3.2 Excimer Lasers 83
5.4 Solid State Lasers 86
5.4.1 ND: YAG Laser 89
5.4.2 ER: YAG Laser 90
5.5 Fiber Lasers 91
5.6 Semiconductor Lasers 96
5.1 Introduction 75
5.2 Lasers Source And Laser System Market Comparison 77
5.3 Gas Lasers 79
5.3.1 Co2 Lasers 79
5.3.2 Excimer Lasers 83
5.4 Solid State Lasers 86
5.4.1 ND: YAG Laser 89
5.4.2 ER: YAG Laser 90
5.5 Fiber Lasers 91
5.6 Semiconductor Lasers 96
6
Segmentation By Process
6.1 Introduction 101
6.2 Cutting And Drilling 102
6.2.1 Cutting 103
6.2.1.1 Fusion Cutting 107
6.2.1.2 Flame Cutting 108
6.2.1.3 Sublimation Cutting 108
6.2.2 Drilling 108
6.2.2.1 Single Pulse Drilling 109
6.2.2.2 Percussion Drilling 109
6.2.2.3 Trepanning Drilling 109
6.2.2.4 Helical Drilling 110
6.3 Marking And Engraving 112
6.3.1 Direct Laser Engraving 114
6.3.2 Direct Photopolymer Laser Imaging 115
6.3.3 Sub Surface Laser Engraving 115
6.4 Micro-Processing 117
6.5 Advanced Processing 119
6.1 Introduction 101
6.2 Cutting And Drilling 102
6.2.1 Cutting 103
6.2.1.1 Fusion Cutting 107
6.2.1.2 Flame Cutting 108
6.2.1.3 Sublimation Cutting 108
6.2.2 Drilling 108
6.2.2.1 Single Pulse Drilling 109
6.2.2.2 Percussion Drilling 109
6.2.2.3 Trepanning Drilling 109
6.2.2.4 Helical Drilling 110
6.3 Marking And Engraving 112
6.3.1 Direct Laser Engraving 114
6.3.2 Direct Photopolymer Laser Imaging 115
6.3.3 Sub Surface Laser Engraving 115
6.4 Micro-Processing 117
6.5 Advanced Processing 119
7
Segmentation By Machine Configuration
7.1 Introduction 122
7.2 Types Of Configuration For Laser Cutting 124
7.2.1 Moving Material Laser Configuration 124
7.2.2 Flying Optics Systems Laser Configuration 124
7.2.3 Hybrid Laser Configuration 124
7.3 Types Of Configuration For Laser Engraving 127
7.3.1 X-Y Surface Based 127
7.3.2 Cylindrical Work Pieces 128
7.3.3 Stationed Laser Machine 128
7.1 Introduction 122
7.2 Types Of Configuration For Laser Cutting 124
7.2.1 Moving Material Laser Configuration 124
7.2.2 Flying Optics Systems Laser Configuration 124
7.2.3 Hybrid Laser Configuration 124
7.3 Types Of Configuration For Laser Engraving 127
7.3.1 X-Y Surface Based 127
7.3.2 Cylindrical Work Pieces 128
7.3.3 Stationed Laser Machine 128
8
Segmentation By Vertical
8.1 Introduction 130
8.2 Aerospace 132
8.3 Architecture 133
8.3.1 Architecture Vertical Segmentation By Process 134
8.4 Automotive 135
8.4.1 Automotive Vertical Segmentation By Process 136
8.5 Commercial 137
8.5.1 Commercial Vertical Segmentation By Process 138
8.5.2 Commercial Vertical Segmentation By Application 139
8.6 Consumer Electronics 140
8.6.1 Consumer Electronic Vertical Segmentation By Application 141
8.7 General Machine Tooling 142
8.7.1 General Machine Tooling Vertical Segmentation By Process 143
8.7.2 General Machine Tooling Vertical Segmentation By Application 144
8.8 Semiconductor & Electronics 145
8.8.1 Semiconductor & Electronics Vertical Segmentation By Process 146
8.8.2 Semiconductor & Electronics Vertical Segmentation By Application 147
8.1 Introduction 130
8.2 Aerospace 132
8.3 Architecture 133
8.3.1 Architecture Vertical Segmentation By Process 134
8.4 Automotive 135
8.4.1 Automotive Vertical Segmentation By Process 136
8.5 Commercial 137
8.5.1 Commercial Vertical Segmentation By Process 138
8.5.2 Commercial Vertical Segmentation By Application 139
8.6 Consumer Electronics 140
8.6.1 Consumer Electronic Vertical Segmentation By Application 141
8.7 General Machine Tooling 142
8.7.1 General Machine Tooling Vertical Segmentation By Process 143
8.7.2 General Machine Tooling Vertical Segmentation By Application 144
8.8 Semiconductor & Electronics 145
8.8.1 Semiconductor & Electronics Vertical Segmentation By Process 146
8.8.2 Semiconductor & Electronics Vertical Segmentation By Application 147
9
Segmentation By Geography
9.1 Introduction 149
9.2 North America 150
9.3 Europe 151
9.4 APAC 152
9.5 Row 153
9.1 Introduction 149
9.2 North America 150
9.3 Europe 151
9.4 APAC 152
9.5 Row 153
10
Competitive Landscape
10.1 Overview 155
10.2 Market Share Analysis 155
10.3 Key Growth Strategies 156
10.4 Competitive Situation And Trends 157
10.4.1 New Product Developments & Announcements 157
10.4.2 Agreements, Partnerships, Joint Ventures And Collaborations 164
10.4.3 Mergers And Acquisitions 166
10.1 Overview 155
10.2 Market Share Analysis 155
10.3 Key Growth Strategies 156
10.4 Competitive Situation And Trends 157
10.4.1 New Product Developments & Announcements 157
10.4.2 Agreements, Partnerships, Joint Ventures And Collaborations 164
10.4.3 Mergers And Acquisitions 166
11
Company Profiles
(Overview, Products & Services, Financials, Strategy And Developments)*
11.1 Alltec GMBH 168
11.2 Alpha Nov Laser 171
11.3 Bystronic, Inc. 175
11.4 Coherent, Inc. 178
11.5 DPSS Laser, Inc. 183
11.6 Epilog Laser, Inc. 187
11.7 Eurolaser GMBH 190
11.8 IPG Photonics Corporation 193
11.9 Jenoptik Laser GMBH 198
11.10 Laserstar Technologies Corporation 202
11.11 Needham Laser Ltd. 204
11.12 Newport Corporation 206
11.13 Prima Industrie S.P.A. 210
11.14 Q-Peak, Inc. 215
11.15 Rofin-Sinar Technologies, Inc. 217
11.16 SEI Laser S.P.A 223
11.17 Trotec Laser, Inc. 226
11.18 Trumpf Laser GMBH + Co. Kg 229
11.19 Universal Laser Systems, Inc. 234
11.20 Xenetech Global, Inc. 237
*Details On Overview, Products & Services, Financials, Strategy And Developments Might Not Be Captured In Case Of Unlisted Companies.
(Overview, Products & Services, Financials, Strategy And Developments)*
11.1 Alltec GMBH 168
11.2 Alpha Nov Laser 171
11.3 Bystronic, Inc. 175
11.4 Coherent, Inc. 178
11.5 DPSS Laser, Inc. 183
11.6 Epilog Laser, Inc. 187
11.7 Eurolaser GMBH 190
11.8 IPG Photonics Corporation 193
11.9 Jenoptik Laser GMBH 198
11.10 Laserstar Technologies Corporation 202
11.11 Needham Laser Ltd. 204
11.12 Newport Corporation 206
11.13 Prima Industrie S.P.A. 210
11.14 Q-Peak, Inc. 215
11.15 Rofin-Sinar Technologies, Inc. 217
11.16 SEI Laser S.P.A 223
11.17 Trotec Laser, Inc. 226
11.18 Trumpf Laser GMBH + Co. Kg 229
11.19 Universal Laser Systems, Inc. 234
11.20 Xenetech Global, Inc. 237
*Details On Overview, Products & Services, Financials, Strategy And Developments Might Not Be Captured In Case Of Unlisted Companies.
For
more details contact Mr. Priyank Tiwari: sales@rnrmarketresearch.com / +18883915441
Website:
http://www.rnrmarketresearch.com
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